Product Info

Smart LTE Module Series
SC66 Hardware Design
SC66_Hardware_Design 84 / 118
MIC3_P
33pF
MEMS-MIC
R2
R1
C2
Module
MIC_GND
0R
C1
MIC_ BIAS
1
2
3
4
F1
D1
OUT
GND
GND
VDD
100nF
C4
0R
33pF
Figure 29: Reference Circuit Design for MEMS-type Microphone
3.22.2. Reference Circuit Design for Earpiece Interface
EAR_P
EAR_N
R2
33pF
33pF
33pF
C2
C3
C1
R1
Module
D1
D2
0R
0R
Figure 30: Reference Circuit Design for Earpiece IInterface