Product Info

LTE Module Series
EG91 Hardware Design
EG91_Hardware_Design 88 / 93
8.3. Packaging
EG91is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until
the devices are ready to be soldered onto the application.
The reel is 330mm in diameter and each reel contains 250pcs modules. The following figures show the
packaging details, measured in mm.
Figure 47: Tape Dimensions
Max slope 2 to 3°C/sec
Reflow time (D: over 220°C) 40 to 60 sec
Max temperature 240°C ~ 245°C
Cooling down slope 1 to 4°C/sec
Reflow Cycle
Max reflow cycle 1