Product Info

LTE Module Series

EG91 Hardware Design

EG91_Hardware_Design 81 / 93

Thermal Pad

Heatsink

Application Board

Heatsink

Thermal Pad

EG91 Module

Shielding Cover

Figure 40: Referenced Heatsink Design (Heatsink at the Backsideof Customers’ PCB)

1. The module offers the best performance when the internal BB chip stays below 105°C. When the

maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but

provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB

chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will

recover to network connected state after the maximum temperature falls below 115°C. Therefore, the

thermal design should be maximally optimized to make sure the maximum BB chip temperature

always maintains below 105°C. Customers can execute AT+QTEMP command and get the

maximum BB chip temperature from the first returned value.

2. For more detailed guidelines on thermal design, please refer to document [6].

NOTES