Product Info

LTE Module Series
BG96 Hardware Design
BG96_Hardware_Design 81 / 81
7.2. Recommended Footprint
22.50±0.15
26.50±0.15
0.92
0.92
1.50
1.10
7.45 7.15
1.95
0.55
1.10
1.65
5.10
1.00
8.50
0.85
1.70
0.85
1.00
1.00
1.70
1.70
0.55
1.50
1.15
1.90
1.10
1.65
0.50
0.70
40x1.0
40x1.0
62x0.7
62x1.15
0.15
0.85
9.60 9.70
11.0311.03
4.254.25
5.955.95
7.657.65
2.55 2.55
9.18 9.18
4.25
5.95
4.25
5.95
0.85
Figure 33: Recommended Footprint (Top View)
1. For easy maintenance of the module, please keep about 3mm between the module and other
components onthe host PCB.
All reserved pins must be kept open.
NOTES