Product Info

LTE Module Series
BG96 Hardware Design
BG96_Hardware_Design 63 / 81
Figure 25: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground)
Figure 26: Coplanar Waveguide Line Designon a4-layer PCB (Layer 4 as Reference Ground)
In order to ensure RF performance and reliability, the following principles should be complied with in RF
layout design:
 Use impedance simulation tool to control the characteristic impedanceof RF tracesas 50Ω.
 The GND pins adjacent to RF pins should not bedesigned as thermal relief pads, and should be fully
connected to ground.
 The distance between the RF pinsand the RFconnectorshould be as short as possible, and all the
right angle tracesshould be changed to curved ones.
 There should be clearance area under the signal pin of the antenna connector or solder joint.
 The reference ground of RF traces should be complete. Meanwhile, adding some ground viasaround
RF traces and the reference ground could help to improve RF performance. The distance between