Product Info

Smart Module Series
SC606T Series Hardware Design
SC606T_Series_Hardware_Design 63 / 116
Rear camera connector
MCAM_PWDN
MCAM_MCLK
CAM_I2C_SDA
CAM_I2C_SCL_
CSI0_LN3_P
CSI0_LN3_N
CSI0_LN2_P
CSI0_LN2_N
CSI0_LN1_P
CSI0_LN1_N
CSI0_LN0_P
CSI0_LN0_N
SCAM_RST
SCAM_ PWDN
SCAM_ MCLK
CSI1_CLK_P
CSI1_CLK_N
CSI1_LN0_P
CSI1_LN0_N
CSI2_LN1_P
CSI2_LN1_N
CSI2_LN0_P
CSI2_LN0_N
CSI0_CLK_P
CSI0_CLK_N
CSI2_CLK_P
CSI2_CLK_N
LDO6_1P8
LDO22_2P8
2.2K
2.2K
Front camera connector
1μF
4.7μF
4.7 μF
1μF
1μF
4.7μF
MCAM_RST
DCAM_PWDN
DCAM_MCLK
DCAM_I2C_SDA_
DCAM_I2C_SCL
DCAM_RST
Depth camera connector
LDO17_2P85
AVDD
AF_VDD
DVDD
DOVDD
EMI
EMI
EMI
EMI
EMI
EMI
EMI
EMI
LDO2_1P1
1 μF
LDO23_1P2
2.2K
2.2K
DVDD
EMI
EMI
4.7
1μF
μF
AVDD
DOVDD
Figure 23: Reference Design for Triple Camera Application
3.18.1. Design Considerations
Pay attention to the pin definitions of LCM and camera connectors to ensure the module and the
connectors are connected correctly.
MIPI is a high-speed signal line whose data rate reaches 2.1 Gbps. The differential impedance
should be kept at 100 Ω, and the trace be routed on the inner layer of PCB and not crossed with other