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Smart Module Series
SC606T Series Hardware Design
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The following is a reference design for the USB Type-C interface:
USB_DP
100 nF
Module
C14
Switch
C2
C3
C4
C5
A0+
A0-
A1+
A0-
B0+
B0-
B1+
B1-
C0+
C0-
C1+
C1-
SEL
PD
USB_SS_TX_P
USB_SS_TX_M
USB_SS_RX_P
USB_SS_RX_M
USB_SS_SEL
R1
VDD
4.7
μF
C1
VDD_3V0
TX1+
TX1-
VBUS_ VBUS
CC
1
D+
D-
RX1-
RX1+
CC2
CC1
CC2
TX2+
TX2-
RX2+
RX2-
USB Type_C
C6
C7
C8
C9
C10
C11
C12
C13
USB_DM
USB_ VBUS
USB_ID
GPIO_1
AW3605DNR
SW
VIN
22 μF
C2
10 μF
10K
1.0 μH
C1
L1
R1
EN
AGND
VOUT
VOUT
NC
PGND
PGND
1
2
9
4
5
6
7
8
VBUS
VPH_PWR
GPIO_97
3
Figure 12: USB Type-C Interface Reference Design
To ensure sound USB performance, please follow these principles in your design:
⚫ Route the USB signal traces as differential pairs with total grounding and keep the impedance of USB
differential traces at 90 Ω.
⚫ Pay attention to the influence of junction capacitance of ESD protection devices upon USB data lines.
Typically, the capacitance should be less than 2 pF for USB 2.0 and less than 0.5 pF for USB 3.0.
⚫ Avoid routing the USB signal traces under crystals, oscillators, magnetic devices, or RF signal traces.
Route the traces in the inner-layer of PCB with ground shielding on not only upper and lower layers
but also right and left sides.
⚫ Keep the ESD protection devices as close to the USB connector as possible.
⚫ Ensure the trace length differences between the USB 2.0 DM/DP differential pair and between the
USB 3.0 RX/TX differential pairs do not exceed 0.7 mm.