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Quectel Wireless Solutions Manuals
Electronics
LTE Module with Bluetooth, WiFi and WCDMA
101
102
103
104
105
106
107
108
109
110
Sm
a
rt
Module
Serie
s
SC606T
Series
H
ardwar
e
Design
SC606T_S
eri
es_
Hard
ware_De
si
gn
104
/
1
16
Figure
43
: Bottom Dim
e
nsion
s (Perspe
ctive Vie
w)
The pack
age warpage lev
el
of
th
e m
odule conf
orms
to JEIT
A
ED
-7
306 stand
ard.
NO
T
E
1
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103
104
105
106
107
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120
