Product Info

LPWA Module Series
BG95 Series Hardware Design
BG95_Series_Hardware_Design 93 / 106
7.2. Recommended Footprint
40x1.0
40x1.0
62x0.7
62x1.10
19.90±0.15
23.60±0.15
9.959.95
7.45 7.15
0.55
1.95
1.10
1.10
9.15 9.15
1.00
1.90
11.80
11.80
11.00
11.00
1.70
0.85
1.70
0.85
1.70
5.95 5.95
4.25 4.25
7.65 7.65
9.70
9.60
1.70
0.85
2.55
4.25
5.95
4.25
5.95
1.70
1.70
2.50
2.50
1.10
1.10
1.10
1.10
1.10
0.70
1.00
1.00
0.20
0.15
1.00
0.25
0.25
0.25
0.25
Figure 36: Recommended Footprint (Top View)
1. For easy maintenance of the module, please keep about 3 mm between the module and other
components on the motherboard.
2. All RESERVED pins must be kept open.
3. For stencil design requirements of the module, see document [5].
NOTES
Pin 1