Product Info
EG95_Seri
e
1.
1)
This f
l
2. To avoi
d
to the a
the rela
t
after th
e
ready f
o
3. Please
the ba
k
proced
u
8.2. Ma
n
Push the s
q
stencil ope
properlyso
a
thethicknes
todocume
n
It is sugge
s
temperatur
e
recommen
d
been com
p
related par
a
NOTES
e
s_Hardw
a
l
oor life is o
n
d
blistering,
ir for a long
t
ive moistur
e
e
package i
s
o
r soldering.
take the m
o
k
ing. If sho
u
re.
n
ufacturi
q
ueegee to
nings and
a
s to produ
c
s of stencil
f
n
t
[
4].
s
ted that t
h
e
is 246 º
C
d
ed that the
p
leted. The
a
meters are
Temp.
(
S
246
200
220
238
150
100
a
re_Design
n
ly applicab
layer sepa
r
time. If the
t
e
is over 60
%
s
removed.
A
o
dule out of
rter baking
ng and
S
apply the
s
then penet
r
c
e a clean s
t
f
or the mod
u
h
e peak ref
l
C
. To avoid
module sh
o
r
ecommen
d
shown bel
o
(
°C)
S
oak Zone
A
Max sl
o
le when the
r
ation and o
t
t
emperatur
e
%
, It is reco
A
nd do not r
e
the packag
time is d
e
S
olderin
g
s
older past
e
r
ate to the
t
encil surfa
c
u
le is recom
l
ow temper
a
damage t
o
o
uld be mo
u
d
ed reflow
s
o
w.
o
pe: 1 to 3°C/s
9
environme
n
t
her solderi
n
e
and moist
u
mmended t
o
e
move the
p
ing and put
e
sired, plea
s
g
e
on the su
PCB. The
c
e on a singl
mended to
b
a
ture is 23
8
o
the modu
u
nted after
s
oldering t
h
9
8 / 103
n
t conforms
n
g issues, it
u
re do not c
o
o
start the s
o
p
ackages of
it on high-t
e
s
e refer to
rface of st
e
force on
t
e pass. To
e
b
e0.13–0.1
5
8
–246 ºC,
a
le caused
b
reflow sold
e
h
ermal pro
f
i
Reflo
w
B
Max sl
o
2 to 3°
C
LTE St
a
EG95 Se
r
to IPC/JED
is forbidde
n
o
nform to I
P
o
lder reflow
tremendou
s
e
mperature
IPC/JEDE
C
e
ncil, thus
m
t
he squeeg
e
e
nsure the
m
5
mm. For
m
a
nd the ab
s
b
y repeate
d
e
ring for th
e
le (lead-fre
e
w
Zone
C
D
Cooli
n
-1.5 t
o
o
pe:
C
/s
a
ndard Mo
d
r
ies Hard
w
EC J-STD-
0
n
to expose
P
C/JEDEC
J
process wi
t
s
modules i
f
resistant fi
x
C
J-STD-03
3
m
aking the
p
e
e should
m
odule sold
e
m
ore details,
s
olute max
i
d
heating, i
t
e
other side
e
reflow so
n
g down slope:
o
-3°C/s
d
ule Serie
s
w
are Desig
n
0
3
3
.
the module
s
J
-
STD-033 o
hin 24 hour
s
f
they are n
o
x
tures befor
e
3
for bakin
g
p
aste fill th
e
be adjuste
d
e
ring qualit
y
please refe
i
mum reflo
w
t
is strongl
y
of PCB ha
s
ldering) an
d
s
n
s
r
s
o
t
e
g
e
d
y
,
r
w
y
s
d