Product Info

EG95_Seri
e
8
S
P
8.1. Sto
r
The modul
e
requiremen
t
1. Recom
m
should
b
2. The sto
3. The flo
o
humidit
y
proces
s
module
cabinet
)
4. The m
o
the foll
o
 Th
e
 Vi
o
 Va
c
 Be
f
5. If need
e
 Th
e
 All
pu
t
e
s_Hardw
a
S
tora
g
P
ack
a
r
age
e
is provide
t
s are show
m
ended St
o
b
e 35%–60
%
rage life (in
o
r life of th
e
y
is below
s
ed in reflo
w
should be
s
)
.
o
dule should
o
wing circu
m
e
module is
o
lation of th
e
c
uum-seale
d
f
ore module
e
d, the pre-
b
e
module s
h
modules m
u
t
in a dry en
v
a
re_Design
g
e,
M
a
ging
d with vac
u
n below.
o
rage Cond
%
.
vacuum-se
a
e
module is
60%. Afte
r
w
soldering
o
s
tored in an
e
be pre-ba
k
m
stances:
not stored i
n
e
third requi
r
d
packagin
g
repairing.
b
aking shou
h
ould be ba
k
u
st be sold
e
v
ironment s
u
M
anu
f
u
um-sealed
ition: The
t
a
led packa
g
168 hours
1
r
the vacu
u
o
r other hig
h
e
nvironmen
k
ed to avoid
n
Recomm
e
r
ement abo
v
g
is broken,
o
ld follow th
e
k
ed for 8 ho
u
e
red to PCB
u
ch as in a
d
9
f
actu
r
packaging.
t
emperature
g
ing) is 12
m
)
in a plant
w
u
m-sealed
p
h
-temperat
u
t where the
blistering,
c
e
nded Stora
g
v
e occurs;
o
r the pack
a
e
requireme
n
u
rs at 120 ±
within 24 h
o
d
rying oven
9
7 / 103
r
ing
a
MSL of th
e
should be
m
onths in R
e
w
here the t
e
p
ackaging
i
u
re operatio
n
relative hu
m
c
racks and i
n
g
e Conditio
n
a
ging has b
e
n
tsbelow:
5°C;
o
urs after t
h
.
LTE St
a
EG95 Se
r
a
nd
e
module is
23±5°C a
n
e
commende
d
e
mperature
i
s removed
n
s within 1
6
m
idity is les
s
n
ne
r
-layer
s
n
;
e
en remove
d
h
e baking, o
a
ndard Mo
d
r
ies Hard
w
rated as 3.
n
d the relat
d
Storage
C
is 23 ±5°C
, the mod
u
6
8 hours. O
t
s
than 10% (
s
eparation i
n
d
for over 2
4
therwise th
e
d
ule Serie
s
w
are Desig
n
Thestorag
e
ive humidit
y
C
ondition.
and relativ
e
u
le must b
e
t
herwise, th
e
e.g. a dryin
g
n
PCB unde
4
hours;
e
y should b
e
s
n
e
y
e
e
e
g
r
e