Product Info

T
m
r
e
EG95_Seri
e
The followi
n
them accor
d
F
Figure
he module
m
aximum te
m
e
duced per
f
NOTE
e
s_Hardw
a
n
g shows t
w
d
ing to their
Ap
p
F
igure 39:
R
A
E
G
40: Refer
e
offers the
b
m
perature o
f
f
ormance (
s
a
re_Design
w
o kinds of h
application
EG95 Modul
e
p
lication Boar
d
R
eference
d
A
pplication Bo
a
G
95 Module
e
nced Hea
t
b
est perfor
m
f
the BB chi
p
s
uch as R
F
eatsink des
i
structure.
e
Thermal
Shielding
C
d
Heatsink
a
rd
t
sink Desi
g
m
ance whe
n
p
reaches o
r
F
output p
o
8
i
gns for refe
Heatsink
Pa
d
C
over
Design (H
e
Thermal Pad
Heatsink
Shielding C
o
g
n (Heatsi
n
n
the inter
n
r
exceeds 1
0
o
wer, data
8
8 / 103
rence and
c
e
atsink at
t
Th
e
o
ver
n
k at the B
a
n
al BB chip
0
5°C, the m
rate, etc.).
LTE St
a
EG95 Se
r
c
ustomers c
a
App
l
H
t
he Top of
A
e
rmal Pa
d
a
ckside of
stays belo
w
odule work
s
When the
a
ndard Mo
d
r
ies Hard
w
a
n choose
o
l
ication Boar
d
H
eatsink
the Modul
e
A
pplication Bo
a
Heatsin
k
Customer
s
w
105°C.
W
s
normal bu
t
maximum
d
ule Serie
s
w
are Desig
n
o
neor both
o
e
)
a
rd
k
s
’ PCB)
W
hen the
t
provides
BB chip
s
n
o
f