User's Manual

LTE Module Series
EC25Hardware Design
EC25_Hardware_DesignConfidential / Released 81 / 90
8 Storage, Manufacturing and
Packaging
8.1. Storage
EC25 is stored in a vacuum-sealed bag. The storage restrictionsare shown as below.
1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH.
2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other
high temperature processes must be:
 Mounted within 72 hours at the factory environment of ≤30ºC/60%RH.
 Stored at <10% RH.
3. Devices require bake before mounting, if any circumstances below occurs:
 When the ambient temperature is 23ºC±5ºC and the humidity indicator card shows the humidity
is >10% before opening the vacuum-sealed bag.
 Device mounting cannot be finished within 72 hours at factory conditions of ≤30ºC/60%RH.
4. If baking is required, devices may be baked for 48 hours at 125ºC±5ºC.
As the plastic packagecannot be subjected to high temperature, it should be removed from devices before
high temperature (125ºC) baking. If shorter baking time is desired, please refer to IPC/JEDECJ-STD-033
for baking procedure.
NOTE