User's Manual

LTE Module Series
EC25Hardware Design
EC25_Hardware_DesignConfidential / Released 53 / 90
20mil.
 The differential impedance of SGMII data trace is 100ohm±10%.
 To minimize crosstalk, the distance between separate adjacent pairs that are on the same layer must
be equal to or larger than 40mil.
For more information about SGMII application, please refer to document [5]and document [7].
3.18. Wireless Connectivity Interfaces
EC25supports a low-power SDIO 3.0 interface for WLAN and a UART/PCM interface for BT.
The following table shows the pin definition of wireless connectivity interfaces.
Table 22: Pin Definition of Wireless Connectivity Interfaces
Pin Name Pin No. I/O Description Comment
WLAN Part
SDC1_DATA3 129 IO SDIO data bus D3 1.8V power domain
SDC1_DATA2 130 IO SDIO data bus D2 1.8V power domain
SDC1_DATA1 131 IO SDIO data bus D1 1.8V power domain
SDC1_DATA0 132 IO SDIO data bus D0 1.8V power domain
SDC1_CLK 133 DO SDIO clock 1.8V power domain
SDC1_CMD 134 IO SDIO command 1.8V power domain
WLAN_EN 136 DO
WLAN function control via FC20
module. Active high.
1.8V power domain
Coexistence and Control Part
PM_ENABLE 127 DO External power control 1.8V power domain
WAKE_ON_
WIRELESS
135 DI
Wake up the host (EC25 module)
by FC20 module.
1.8V power domain
COEX_UART_RX 137 DI LTE/WLAN&BT coexistence signal 1.8V power domain
NOTE