User's Manual

LTE Module Series
EC25Hardware Design
EC25_Hardware_DesignConfidential / Released 9 / 90
FIGURE 37: DIMENSIONS OF THE UF.L-R-SMT CONNECTOR (UNIT: MM) ................................................ 66
FIGURE 38: MECHANICALS OF UF.L-LP CONNECTORS ............................................................................. 66
FIGURE 39: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 67
FIGURE 40: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 77
FIGURE 41: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ................................................................. 78
FIGURE 42: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 79
FIGURE 43: TOP VIEW OF THE MODULE ...................................................................................................... 80
FIGURE 44: BOTTOM VIEW OF THE MODULE .............................................................................................. 80
FIGURE 45: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 82
FIGURE 46: TAPE AND REEL SPECIFICATIONS ........................................................................................... 83