EC C25Hardw warre Des sign n LTE Module M S Series Rev. EC25_Ha ardware_ _Design_ _V1.3 Date: 2017-01-24 ww ww.quectel.
LTE Module Series EC25Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233 Tel: +86 21 5108 6236 Email:info@quectel.com Or our local office.For more information, please visit: http://www.quectel.com/support/salesupport.
LTE Module Series EC25Hardware Design About the Document History Revision Date Author Description 1.0 2016-04-01 Woody WU Initial 1. 2. 1.1 2016-09-22 Lyndon LIU/ Frank WANG Updated EC25 series frequency bands in Table 1. Updated transmitting power, supported maximum baud rate of main UART/internal protocols/USB drivers of USB interface, firmware upgrade and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4. Updated timing of turning off module in Figure 13. 5.
LTE Module Series EC25Hardware Design 3. 4. 5. 6. 7. 8. EC25_Hardware_DesignConfidential / Released Added BT interface in Chapter 3.18.2. Updated GNSS performance in Table 24. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 29. Updated current consumption of EC25-E module in Table 33. Updated EC25-A conducted RF receiving sensitivity in Table 38. AddedEC25-J conducted RF receiving sensitivity in Table 40.
LTE Module Series EC25Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 4 Table Index ..............................................................................................................................................
LTE Module Series EC25Hardware Design 3.15. STATUS ................................................................................................................................ 49 3.16. Behavior of the RI ................................................................................................................. 50 3.17. SGMII Interface ..................................................................................................................... 51 3.18. Wireless Connectivity Interfaces ....
LTE Module Series EC25Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF EC25 SERIES MODULE........................................................................ 12 TABLE 2: KEY FEATURES OF EC25 MODULE ............................................................................................... 13 TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 19 TABLE 4: PIN DESCRIPTION ....................................
LTE Module Series EC25Hardware Design TABLE 42: RELATED DOCUMENTS ................................................................................................................ 84 TABLE 43: TERMS AND ABBREVIATIONS ...................................................................................................... 84 TABLE 44: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 88 TABLE 45: GPRS MULTI-SLOT CLASSES ...................................
LTE Module Series EC25Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 16 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 18 FIGURE 3: SLEEP MODE APPLICATION VIA UART .......................................................................................
LTE Module Series EC25Hardware Design FIGURE 37: DIMENSIONS OF THE UF.L-R-SMT CONNECTOR (UNIT: MM) ................................................ 66 FIGURE 38: MECHANICALS OF UF.L-LP CONNECTORS ............................................................................. 66 FIGURE 39: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 67 FIGURE 40: MODULE TOP AND SIDE DIMENSIONS............................................................................
LTE Module Series EC25Hardware Design 1 Introduction This document defines the EC25module and describes its air interface and hardware interface which are connected with your application. This document can help you quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC25 module. Associated with application note and user guide, you can use EC25 module to design and set up mobile applications easily.
LTE Module Series EC25Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
LTE Module Series EC25Hardware Design 2 Product Concept 2.1. General Description EC25 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity, which provides data connectivity on LTE-FDD,LTE-TDD,DC-HSPA+, HSPA+, HSDPA, HSUPA, WCDMA,EDGE andGPRSnetworks. It also provides GNSS1) and voice functionality2) for your specific application.EC25 contains fivevariants:EC25-E, EC25-A, EC25-V, EC25-Jand EC25-AU. You can choose a dedicated type based on the region or operator.
LTE Module Series EC25Hardware Design With a tiny profile of 32.0mm ×29.0mm ×2.4mm, EC25 can meet almost all requirements for M2M applications such as automotive, metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. EC25 is an SMD type module which can be embedded in applications through its 144-pin pads, including 80 LCC signal pads and 64 other pads. 2.2. Key Features The following table describes the detailed features of EC25 module.
LTE Module Series EC25Hardware Design Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Internet Protocol Features SupportTCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/HTTPS*/SMTP*/MMS* /FTPS*/SMTPS*/SSL*protocols Support the protocols PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) usually used for PPP connections SMS Text and PDU mode Point to point MO and MT S
LTE Module Series EC25Hardware Design Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features Gen8CLite of Qualcomm Protocol: NMEA 0183 AT Commands Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Network Indication Two pins including NET_MODE and NET_STATUS to indicate network connectivity status Antenna Interface Including main antenna interface (ANT_MAIN), Rx-diversityantenna interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS) Physical Characteristics Size: 32.
LTE Module Series EC25Hardware Design Power management Baseband DDR+NAND flash Radio frequency Peripheral interfaces ANT_MAIN ANT_GNSS ANT_DIV Switch SAW Switch Duplex LNA SAW VBAT_RF APT PA PRx DRx Tx NAND DDR2 SDRAM Transceiver IQ VBAT_BB PMIC Control Control PWRKEY Baseband RESET_N ADCs 19.2M XO STATUS VDD_EXT USB USIM PCM SGMII WLAN I2C UART GPIOs BT Figure 1: Functional Diagram 2.4.
LTE Module Series EC25Hardware Design 3 Application Interface 3.1. General Description EC25 is equipped with 80-pin SMT pads plus 64-pin ground pads and reserved pads that can beconnected to cellular application platform.
LTE Module Series EC25Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EC25 module.
LTE Module Series EC25Hardware Design 5. 6. 7. 8. Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on FC20 module. Keep all RESERVEDpins and unused pins unconnected. GND pads 85~112 should be connected to ground in the design, and RESERVED pads 73~84should not be designed in schematic and PCB decal. ※ “ ”means these interface functions are only supported on Telematics version. 3.3. Pin Description The following tables show the pin definition of EC25 modules.
LTE Module Series EC25Hardware Design bursttransmission. VDD_EXT 7 PO GND 8,9,19,22,3 6,46,48,50 ~54,56,72, 85~112 Provide 1.8V for external circuit Vnorm=1.8V IOmax=50mA Power supply for external GPIO’s pull up circuits. Ground Turn on/off Pin Name PWRKEY RESET_N Pin No. Description DC Characteristics Comment Turnon/off the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. DI Reset the module VIHmax=2.1V VIHmin=1.
LTE Module Series EC25Hardware Design USB_DM 70 IO USB differential data bus Compliant with USB 2.0 standard specification. Require differential impedance of 90ohm. I/O Description DC Characteristics Comment USIM Interface Pin Name Pin No. USIM_GND 10 Specified ground for USIM card For 1.8V USIM: Vmax=1.9V Vmin=1.7V USIM_VDD USIM_DATA USIM_CLK USIM_RST USIM_ PRESENCE 14 15 16 17 13 PO IO DO DO DI Power supply for USIM card For 3.0V USIM: Vmax=3.05V Vmin=2.7V IOmax=50mA For 1.
LTE Module Series EC25Hardware Design VIHmin=1.2V VIHmax=2.0V open. Description DC Characteristics Comment 1.8V power domain. If unused, keep it open. UART Interface Pin Name Pin No. I/O RI 62 DO Ring indicator VOLmax=0.45V VOHmin=1.35V DCD 63 DO Data carrier detection VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. Clear to send VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. Request to send VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.
LTE Module Series EC25Hardware Design ADC Interface Pin Name ADC0 ADC1 Pin No. I/O Description DC Characteristics Comment AI General purpose analog to digital converter Voltage range: 0.3V to VBAT_BB If unused, keep it open. 44 AI General purpose analog to digital converter Voltage range: 0.3V to VBAT_BB If unused, keep it open. Pin No. I/O Description DC Characteristics Comment PCM data input VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain.
LTE Module Series EC25Hardware Design SGMII Interface Pin Name Pin No. EPHY_RST_ 119 N EPHY_INT_N 120 SGMII_ MDATA SGMII_ MCLK 121 122 I/O Description DC Characteristics For 1.8V: VOLmax=0.45V VOHmin=1.4V DO Ethernet PHY reset For 2.85V: VOLmax=0.35V VOHmin=2.14V DI IO DO Ethernet PHY interrupt SGMII MDIO (Management Data Input/Output) data SGMII MDIO (Management Data Input/Output) clock VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V For 1.8V: VOLmax=0.45V VOHmin=1.4V VILmax=0.
LTE Module Series EC25Hardware Design - plus open. SGMII_RX_P 125 AI SGMII receiving - plus If unused, keep it open. SGMII_RX_M 126 AI SGMII receiving -minus If unused, keep it open. Wireless Connectivity Interfaces Pin Name SDC1_ DATA3 SDC1_ DATA2 SDC1_ DATA1 SDC1_ DATA0 Pin No. 129 130 131 132 I/O IO IO IO IO Description DC Characteristics Comment SDIO data bus D3 VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain.
LTE Module Series EC25Hardware Design FC20 module. VIHmin=1.2V VIHmax=2.0V If unused, keep it open. WLAN function control via FC20 module VOLmax=0.45V VOHmin=1.35V 1.8V power domain. Active high. If unused, keep it open. DI LTE/WLAN&BT coexistence signal VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. COEX_UART 138 _TX DO LTE/WLAN&BT coexistence signal VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open.
LTE Module Series EC25Hardware Design Pin Name WAKEUP_IN W_DISABLE# AP_READY Pin No. 1 4 2 I/O DI Description Sleep mode control DC Characteristics Comment VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Cannot be pulled up before startup. Low level wakes up the module. If unused, keep it open. 1.8V power domain. Pull-up by default. In low voltage level, module can enter into airplane mode. If unused, keep it open. DI Airplane mode control VILmin=-0.3V VILmax=0.
LTE Module Series EC25Hardware Design 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters. Table 5: Overview of Operating Modes Mode Normal Operation Details Idle Software is active. The module hasregistered onthe network, and it is ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network settingand data transfer rate.
LTE Module Series EC25Hardware Design The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART Driving the host DTR to low level will wake up the module. When EC25 has URC to report, RI signal will wake up the host. Refer to Chapter 3.16 for details about RI behavior. AP_READY will detect the sleep state of the host (can be configured to high level or low level detection). Please refer to AT+QCFG=“apready”command for details.
LTE Module Series EC25Hardware Design The following figure shows the connection between the module and the host. Figure 4: Sleep ModeApplication with USB Remote Wakeup Sending data to EC25through USB will wake up the module. When EC25has URC to report, the module will send remote wake-up signals viaUSB bus so as to wake up the host. 3.5.1.3.
LTE Module Series EC25Hardware Design Sending data to EC25through USB will wake up the module. When EC25has URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, you should disconnect USB_VBUS with additional control circuit to let the module enter into sleep mode. Execute AT+QSCLK=1commandto enable the sleep mode. Ensure the DTR is held in high level or keep it open. Disconnect USB_VBUS.
LTE Module Series EC25Hardware Design Hardware: The W_DISABLE# pin is pulled up by default; driving it to low level will let the module enter into airplane mode. Software: AT+CFUNcommand provides the choice of the functionality level. AT+CFUN=0: Minimum functionality mode; both USIM and RF functions are disabled. AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: Airplane mode. RF function is disabled. NOTES 1. The W_DISABLE# control function is disabled in firmware by default.
LTE Module Series EC25Hardware Design 72, 85~112 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3Vto4.3V. Please make sure that the input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G and 4G networks. Burst Transmission Burst Transmission VBAT Min.3.
LTE Module Series EC25Hardware Design 3.6.3. Reference Design for Power Supply Power design for the module is very important, asthe performance of the module largely depends on the power source. The power supply is capable of providing sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is suggested that you shoulduse an LDO to supply power for the module.
LTE Module Series EC25Hardware Design Table 7: PWRKEY Pin Description Pin Name PWRKEY Pin No. 21 Description DC Characteristics Comment Turn on/off the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. When EC25 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 100ms. It is recommended to use an open drain/collector driver to control the PWRKEY.
LTE Module Series EC25Hardware Design The turn on scenario is illustrated in the following figure. Figure 12: Timing of Turning on Module NOTE Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms. 3.7.2. Turn off Module The following procedures can be used to turn off the module: Normal power down procedure: Turn off the module using the PWRKEY pin. Normal power down procedure: Turn off the module using AT+QPOWDcommand. 3.7.2.1.
LTE Module Series EC25Hardware Design Figure 13: Timing of Turning off Module 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWDcommand to turn off the module, which is similar to turning off the module via PWRKEY pin. Please refer todocument [2] for details about AT+QPOWD command. NOTE Inorder to avoid damaging internal flash, please do not switch off the power supply when the module works normally.
LTE Module Series EC25Hardware Design The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 14: Reference Circuit of RESET_N by Using Driving Circuit Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated inthe following figure.
LTE Module Series EC25Hardware Design NOTES 1. 2. Use RESET_N only when turning off the module by AT+QPOWDcommand and PWRKEY pin failed. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. USIM Card Interface The USIM card interface circuitrymeets ETSI and IMT-2000 SIM interface requirements. Both 1.8V and 3.0V USIM cards are supported. Table 9: Pin Definition of the USIM Card Interface Pin Name Pin No. I/O Description Comment Either 1.8V or 3.
LTE Module Series EC25Hardware Design The following figure shows a reference design for USIM card interface with an 8-pin USIM card connector. Figure 17: Reference Circuit of USIM Card Interface with an 8-Pin USIM Card Connector If USIM card detection function is not needed, please keep USIM_PRESENCE unconnected. Areference circuit for USIM card interface witha 6-pin USIM card connector is illustrated inthe following figure.
LTE Module Series EC25Hardware Design In order to enhance the reliability and availability of the USIM card in your application, please follow the criteria below in USIM circuit design: Keep layout of USIM card as close to the module as possible. Keep the trace length as less than 200mm as possible. Keep USIM card signals away from RF and VBAT traces. Assure the ground between the module and the USIM card connector short and wide. Keep thetrace width of ground and USIM_VDD no less than 0.
LTE Module Series EC25Hardware Design The USB interface is recommended to be reserved for firmware upgrade in your design. The following figure shows areference circuit of USB interface. Figure 19: Reference Circuit of USB Application In order to ensurethe integrity of USB data line signal, components R1, R2, R3 and R4 must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible.
LTE Module Series EC25Hardware Design 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features. The main UART interface supports4800, 9600, 19200,38400,57600,115200,230400,460800,921600 and3000000bps baud rates, and the default is 115200bps. This interface is used for data transmission and AT command communication. The debug UART interface supports 115200bps baud rate.
LTE Module Series EC25Hardware Design Table 13:Logic Levels of Digital I/O Parameter Min. Max. Unit VIL -0.3 0.6 V VIH 1.2 2.0 V VOL 0 0.45 V VOH 1.35 1.8 V The module provides 1.8V UART interface. A level translator should be used if your application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instrument is recommended. The following figure shows a reference design. Figure 20: Reference Circuit with Translator Chip Please visit http://www.
LTE Module Series EC25Hardware Design Figure 21: Reference Circuit with Transistor Circuit NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12.
LTE Module Series EC25Hardware Design Figure 22: Primary Mode Timing Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_IN 24 DI PCM data input 1.8V power domain PCM_OUT 25 DO PCM data output 1.8V power domain PCM_SYNC 26 IO PCM data frame sync signal 1.
LTE Module Series EC25Hardware Design PCM_CLK 27 IO PCM data bit clock 1.8V power domain I2C_SCL 41 OD I2C serial clock Require external pull-up to 1.8V I2C_SDA 42 OD I2C serial data Require external pull-up to 1.8V Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048kHzPCM_CLK and 8kHz PCM_SYNC.Please refer to document [2] about AT+QDAIcommand for details.
LTE Module Series EC25Hardware Design Table 15: Pin Definition of the ADC Pin Name Pin No. Description ADC0 45 General purpose analog to digital converter ADC1 44 General purpose analog to digital converter The following table describes the characteristic of the ADC function. Table 16: Characteristic of the ADC Parameter Min. ADC0 Voltage Range ADC1 Voltage Range Typ. Max. Unit 0.3 VBAT_BB V 0.3 VBAT_BB V 15 bits ADC Resolution NOTES 1. 2. 3.
LTE Module Series EC25Hardware Design NOTE 1) meansthat this pin cannot be pulled up before startup.
LTE Module Series EC25Hardware Design Table 19: Pin Definition of STATUS Pin Name STATUS Pin No. 61 I/O Description Comment OD Indicate the module operation status Require external pull-up The following figure shows different circuitdesigns of STATUS, and you can choose either one according to your application demands. Figure 26: Reference Circuits of STATUS 3.16. Behavior of the RI AT+QCFG=“risignaltype”,“physical”command can be used to configure RI behavior.
LTE Module Series EC25Hardware Design The RI behavior can be changed by AT+QCFG=“urc/ri/ring” command. Please refer to document [2] for details. 3.17. SGMII Interface EC25 includes an integrated Ethernet MAC with an SGMII interface and twomanagement interfaces,key features of the SGMII interface are shown below: IEEE802.
LTE Module Series EC25Hardware Design SGMII_RX_P 125 AI SGMII receiving-plus Connect with a 0.1uF capacitor, close to EC25 module. SGMII_RX_M 126 AI SGMII receiving-minus Connect with a 0.1uF capacitor, close to EC25 module. The following figure shows the simplified block diagram for Ethernet application. Figure 27: Simplified Block Diagram for Ethernet Application The following figure shows a reference design ofSGMII interface with PHY AR8033 application. Module R1 10K R2 1.
LTE Module Series EC25Hardware Design 20mil. The differential impedance of SGMII data trace is 100ohm±10%. To minimize crosstalk, the distance between separate adjacent pairs that are on the same layer must be equal to or larger than 40mil. NOTE For more information about SGMII application, please refer to document [5]and document [7]. 3.18. Wireless Connectivity Interfaces EC25supports a low-power SDIO 3.0 interface for WLAN and a UART/PCM interface for BT.
LTE Module Series EC25Hardware Design COEX_UART_TX 138 DO LTE/WLAN&BT coexistence signal WLAN_SLP_CLK 118 DO WLAN sleep clock 1.8V power domain BT Part* BT_RTS* 37 DI BT UART request to send 1.8V power domain BT_TXD* 38 DO BT UART transmit data 1.8V power domain BT_RXD* 39 DI BT UART receive data 1.8V power domain BT_CTS* 40 DO BT UART clear to send 1.8V power domain PCM_IN1) 24 DI PCM data input 1.8V power domain PCM_OUT1) 25 DO PCM data output 1.
LTE Module Series EC25Hardware Design Module WLAN FC20 Module SDC1_DATA3 SDIO_D3 SDC1_DATA2 SDIO_D2 SDC1_DATA1 SDIO_D1 SDC1_DATA0 SDIO_D0 SDC1_CLK SDIO_CLK SDC1_CMD SDIO_CMD WLAN_EN WLAN_EN 32KHz_IN WLAN_SLP_CLK WAKE_ON_WIRELESS WAKE_ON_WIRELESS COEX & Control COEX_UART_RX LTE_UART_TXD COEX_UART_TX LTE_UART_RXD PM_ENABLE DCDC/LDO BT_EN BT_EN BT VDD_3V3 BT_RTS BT_UART_RTS BT_CTS BT_UART_CTS BT_TXD BT_UART_RXD BT_RXD BT_UART_TXD PCM_IN PCM_OUT PCM_OUT PCM_IN PCM_CLK
LTE Module Series EC25Hardware Design As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.0 specification, please comply with the following principles: It is important to route the SDIO signal traces with total grounding. The impedance of SDIOsignal trace is 50ohm(±10%). Protect other sensitive signals/circuits(RF, analog signals, etc.) from SDIO corruption and protect SDIO signals from noisy signals (clocks, DCDCs, etc.).
LTE Module Series EC25Hardware Design The following figure shows a reference circuit of USB_BOOT interface.
LTE Module Series EC25Hardware Design 4 GNSS Receiver 4.1. General Description EC25 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC25 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EC25 GNSS engine is switched off. It has to be switched on via AT command.
LTE Module Series EC25Hardware Design Accuracy (GNSS) @open sky XTRA enabled 1.8 s CEP-50 Autonomous @open sky <1.5 m NOTES 1. 2. 3. Tracking sensitivity: the lowest GNSSsignal value at the antenna port on which the module can keep on positioning for 3 minutes. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock.
LTE Module Series EC25Hardware Design 5 Antenna Interfaces EC25 antenna interfaces include a main antenna interface,anRx-diversity antennainterface which is used toresist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The antenna interfaces have an impedance of 50ohm. 5.1. Main/Rx-diversityAntenna Interface 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversityantenna interfaces are shown below.
LTE Module Series EC25Hardware Design B7 2500~2570 2620~2690 MHz B8 (900) 880~915 925~960 MHz B12 699~716 729~746 MHz B13 777~787 746~756 MHz B18 815~830 860~875 MHz B19 830~845 875~890 MHz B20 832~862 791~821 MHz B26 814~849 859~894 MHz B28 703~748 758~803 MHz B38 2570~2620 2570~2620 MHz B40 2300~2400 2300~2400 MHz B41 2555~2655 2555~2655 MHz 5.1.3.
LTE Module Series EC25Hardware Design NOTES 1. 2. 3. Keep a proper distance between the main antenna and theRx-diversityantenna to improve the receiving sensitivity. ANT_DIV function is enabledby default. Place theπ-type matching components (R1, C1, C2, R2, C3, C4) as close to the antenna as possible. 5.1.4. Reference Design of RF Layout For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50 ohm.
LTE Module Series EC25Hardware Design Figure 34: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 35: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: Use impedance simulation tool to control the characteristic impedanceof RF tracesas 50ohm.
LTE Module Series EC25Hardware Design 5.2. GNSS Antenna Interface The following tables show pin definition and frequency specification of GNSS antenna interface. Table 27: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS 47 AI GNSS antenna 50ohmimpedance Table 28: GNSS Frequency Type Frequency Unit GPS/Galileo/QZSS 1575.42±1.023 MHz GLONASS 1597.5~1605.8 MHz BeiDou 1561.098±2.046 MHz A reference design of GNSS antenna is shown as below.
LTE Module Series EC25Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 29: Antenna Requirements Type Requirements GNSS Frequency range: 1561~1615MHz Polarization: RHCP or linear VSWR: <2 (Typ.) Passive antenna gain: >0dBi Active antenna noise figure: <1.5dB Active antenna gain: >-2dBi Active antenna embedded LNA gain: 20dB (Typ.) Active antenna total gain: >18dBi (Typ.
LTE Module Series EC25Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use UF.L-R-SMT connector provided by HIROSE. Figure 37: Dimensions of the UF.L-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the UF.L-R-SMT. Figure 38:Mechanicals of UF.
LTE Module Series EC25Hardware Design The following figure describes the space factor of mated connector. Figure 39:Space Factor of Mated Connector (Unit: mm) For more details, please visithttp://hirose.com.
LTE Module Series EC25Hardware Design 6 Electrical, Reliability and RadioCharacteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 30: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 1.8 A Voltage at Digital Pins -0.3 2.
LTE Module Series EC25Hardware Design 6.2. Power Supply Ratings Table 31: The Module Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF Voltage must stay within the min/max values, including voltage drop, ripple and spikes. 3.3 3.8 4.3 V Voltage drop during burst transmission Maximum power control level on GSM900. 400 mV IVBAT Peak supply current (during transmissionslot) Maximum power control level on GSM900. 1.8 2.
LTE Module Series EC25Hardware Design 6.4. Current Consumption Table 33: EC25-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 20 uA AT+CFUN=0 (USB disconnected) 1.4 mA GSM DRX=2 (USB disconnected) 2.74 mA GSM DRX=9 (USB disconnected) 2.0 mA WCDMA PF=64 (USB disconnected) 2.7 mA WCDMA PF=128 (USB disconnected) 2.3 mA LTE-FDD PF=64 (USB disconnected) 2.0 mA LTE-FDD PF=128 (USB disconnected) 1.9 mA LTE-TDD PF=64 (USB disconnected) 4.
LTE Module Series EC25Hardware Design EDGE data transfer (GNSS OFF) WCDMA datatransfer(GNSS OFF) LTE datatransfer(GNSS OFF) DCS1800 4DL/1UL @28.9dBm 181.3 mA DCS1800 3DL/2UL @28.9dBm 305.3 mA DCS1800 2DL/3UL @28.8dBm 420.1 mA DCS1800 1DL/4UL @28.6dBm 531.6 mA GSM900 4DL/1UL PCL=8 @26.5dBm 156.4 mA GSM900 3DL/2UL PCL=8 @26.5dBm 248.1 mA GSM900 2DL/3UL PCL=8 @26.4dBm 340.1 mA GSM900 1DL/4UL PCL=8 @26.3dBm 438.8 mA DCS1800 4DL/1UL PCL=2 @24.9dBm 158.
LTE Module Series EC25Hardware Design GSM voice call WCDMA voice call GSM900 PCL=5 @32.2dBm 231.7 mA DCS1800PCL=0 @23.35dBm 188.8 mA WCDMA B1 @22.89dBm 724.7 mA WCDMA B5 @22.92dBm 698.2 mA WCDMA B8 @22.82dBm 628.2 mA Table 34: EC25-A Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 20 uA AT+CFUN=0 (USB disconnected) 0.99 mA WCDMA PF=64 (USB disconnected) 2.0 mA WCDMA PF=128 (USB disconnected) 1.6 mA LTE-FDD PF=64 (USB disconnected) 2.
LTE Module Series EC25Hardware Design WCDMA voice call WCDMA B2 @23.61dBm 670.2 mA WCDMA B4 @23.21dBm 630.3 mA WCDMA B5 @23.34dBm 536.7 mA Table 35: GNSS Current Consumption of EC25 Series Module Parameter IVBAT (GNSS) Description Conditions Typ. Unit Searching Cold start @Passive Antenna 54.0 mA (AT+CFUN=0) Lost state @Passive Antenna 53.9 mA Instrument Environment 30.5 mA Open Sky @Passive Antenna 33.2 mA Open Sky @Active Antenna 40.8 mA Tracking (AT+CFUN=0) 6.5.
LTE Module Series EC25Hardware Design NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the GSM specification as described in Chapter 13.16of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show conducted RF receiving sensitivity of EC25 series module. Table 37: EC25-E Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) GSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.
LTE Module Series EC25Hardware Design WCDMA B2 -110.0dBm / / -104.7dBm WCDMA B4 -110.0dBm / / -106.7dBm WCDMA B5 -110.5dBm / / -104.7dBm LTE-FDD B2 (10M) -98.0dBm -98.0dBm -101.0dBm -94.3dBm LTE-FDD B4 (10M) -97.5dBm -99.0dBm -101.0dBm -96.3dBm LTE-FDD B12 (10M) -96.5dBm -98.0dBm -101.0dBm -93.3dBm Table 39: EC25-V Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP (SIMO) LTE-FDD B4 (10M) -97.5dBm -99.0dBm -101.0dBm -96.
LTE Module Series EC25Hardware Design NOTE 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance. 6.7. Electrostatic Discharge The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components.
LTE Module Series EC25Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module.All dimensions are measured in mm. 7.1. Mechanical Dimensions of the Module (32+/-0.15) (29+/-0.15) 2.4+/-0.2 0.
LTE Module Series EC25Hardware Design 32.0 1.30 3.85 3.5 1.90 3.35 5.96 1.30 2.0 2.0 0.82 3.0 1.15 2.15 1.8 2.8 29.0 1.8 4.88 1.05 1.10 1.6 4.8 6.75 1.10 1.7 2.49 1.9 3.2 3.4 3.2 3.4 2.4 3.45 3.2 0.8 3.5 4.4 1.
LTE Module Series EC25Hardware Design 7.2. Recommended Footprint 24.70 1.80 1.10 3.00 2.00 2.00 1.10 7.80 1.90 3.45 3.40 3.85 2.00 4.80 1.80 3.00 0.50 2.80 0.50 4.80 0.50 4.80 Keepout area 15.60 0.50 3.50 1.90 3.20 1.30 3.20 3.40 3.40 3.20 32.0 3.40 4.80 0.80 2.50 1.00 Figure 42: Recommended Footprint (Top View) NOTES 1. 2. The keepout area should not be designed.
LTE Module Series EC25Hardware Design 7.3. Design Effect Drawings of the Module Figure 43: Top View of the Module Figure 44: Bottom View of the Module NOTE These are design effect drawings of EC25 module. For more accurate pictures, please refer to the module that you get from Quectel.
LTE Module Series EC25Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage EC25 is stored in a vacuum-sealed bag. The storage restrictionsare shown as below. 1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be: Mounted within 72 hours at the factory environment of ≤30ºC/60%RH. Stored at <10% RH. 3.
LTE Module Series EC25Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properlyso as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, thethickness of stencil for the module is recommended to be 0.18mm. For more details, please refer todocument [4].
LTE Module Series EC25Hardware Design 8.3. Packaging 0 0± .1 29.3± 0.15 0.35± 0.05 30.3± 0.15 5 1. 44.00± 0.3 20.20± 0.15 44.00± 0.1 2.00± 0.1 4.00± 0.1 30.3± 0.15 1.75± 0.1 EC25 is packaged in tap andreel carriers. One reel is 11.53m long and contains 250pcs modules. The figure below shows the package details, measured in mm. 4.2± 0.15 3.1± 0.15 32.5± 0.15 33.5± 0.15 32.5± 0.15 33.5± 0.15 e p a t r e v o C 48.5 13 100 d e e f f o n o i t c e r i D 44.5+0.20 -0.
LTE Module Series EC25Hardware Design 9 Appendix A References Table 42: Related Documents SN Document Name Remark [1] Quectel_EC25_Power_Management_Application_ Note EC25 Power Management Application Note [2] Quectel_EC25&EC21_AT_Commands_Manual EC25 and EC21 AT Commands Manual [3] Quectel_EC25&EC21_GNSS_AT_Commands_ Manual EC25 and EC21 GNSS AT Commands Manual [4] Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide [5] Quectel_EC25_Reference_Design EC25 Reference Des
LTE Module Series EC25Hardware Design DL Downlink DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate ESD Electrostatic Discharge FDD Frequency Division Duplex FR Full Rate GLONASS GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System GPS Global Positioning System GSM Global System for Mobile Communications HR Half Rate HSPA High Speed Pac
LTE Module Series EC25Hardware Design PAP Password Authentication Protocol PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RHCP Right Hand Circularly Polarized Rx Receive SGMII Serial Gigabit Media IndependentInterface SIM Subscriber Identification Module SIMO Single Input Multiple Output SMS Short Message Service TDD Time Division Duplexing TDMA Time Division
LTE Module Series EC25Hardware Design VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value VSWR Voltage Standing Wave Ratio WCDMA Wideb
LTE Module Series EC25Hardware Design 10 Appendix B GPRS Coding Schemes Table 44: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate 1/2 2/3 3/4 1 USF 3 3 3 3 Pre-coded USF 3 6 6 12 Radio Block excl.USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 - Coded Bits 456 588 676 456 Punctured Bits 0 132 220 - Data Rate Kb/s 9.05 13.4 15.6 21.
LTE Module Series EC25Hardware Design 11 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots.
LTE Mo odule Sires s E EC25Hardw ware Design n 12 Apppendixx D EDGE E E Mod dulationan nd Cod ding Schem S mes E Modu ulation and Coding Sch hemes Table 46: EDGE Coding Sch heme Mod dulation Coding Family 1 Timeslot 2 Tim meslot 4 Timeslot CS-1: GMSK / 9.05kbps 9 18.1kkbps 36.2kbps CS-2: GMSK / 13.4kbps 26.8kkbps 53.6kbps CS-3: GMSK / 15.6kbps 31.2kkbps 62.4kbps CS-4: GMSK / 21.4kbps 2 42.8kkbps 85.6kbps MCS-1 GMSK C 8.80kbps 8 17.60 0kbps 35.20kbps MCS-2 GMSK B 11.
