User's Manual

LTE Module Series
BG96 Hardware Design
BG96_Hardware_Design Confidential / Released 71 / 71
It is suggested that the peak reflow temperature is 235~245ºC (for SnAg3.0Cu0.5 alloy). The absolute
max reflow temperature is 260ºC. To avoid damage to the module caused by repeated heating, it is
suggested that the module should be mounted after reflow soldering for the other side of PCB has been
completed. Recommended reflow soldering thermal profile is shown below.
Time
50
100
150 200
250 300
50
100
150
200
250
160ºC
200ºC
217
0
70s~120s
40s~60s
Between 1~3ºC/s
Preheat Heating Cooling
ºC
s
Liquids Temperature
Temperature
Figure 45: Reflow Soldering Thermal Profile
During manufacturing and soldering, or any other processes that may contact the module directly, NEVER
wipe the module label with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol,
trichloroethylene, etc.
8.3. Packaging
The information will be added in the future version of this document.
NOTE