User's Manual

LTE Module Series
BG96 Hardware Design
BG96_Hardware_Design Confidential / Released 70 / 71
8 Storage, Manufacturing and Packaging
8.1. Storage
BG96 is stored in a vacuum-sealed bag. The storage restrictions are shown as below.
1. Shelf life in the vacuum-sealed bag: 12 months at <40ºC/90%RH.
2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other
high temperature processes must be:
 Mounted within 168 hours at the factory environment of ≤30ºC/60%RH.
 Stored at <10%RH.
3. Devices require baking before mounting, if any circumstance below occurs.
 When the ambient temperature is 23ºC±5ºC and the humidity indication card shows the humidity
is >10% before opening the vacuum-sealed bag.
 Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60%
4. If baking is required, devices may be baked for 48 hours at 125ºC±5ºC.
As the plastic package cannot be subjected to high temperature, it should be removed from devices
before high temperature (125ºC ) baking. If shorter baking time is desired, please refer to
IPC/JEDECJ-STD-033 for baking procedure.
8.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil for the module is recommended to be 0.18mm. For more details, please refer to
document [5].
NOTE