User's Manual

LTE Module Series
BG96 Hardware Design
BG96_Hardware_Design Confidential / Released 68 / 71
1.00
1.70
0.70
0.55
0.85
1.00
1.70
1.70
62x0.7
40x1.00
40x1.00
22.50
26.50
1.65
1.50
1.50
1.65
1.15
1.15
7.45
7.15
0.85
5.10
0.20
1.10
1.90
1.10
1.95
1.00
1.10
1.10
62x1.15
8.50
Figure 42: Recommended Stencil Design (Top View)
1. For easy maintenance of the module, please keep about 3mm between the module and other
components in the host PCB.
2. All Reserved pins MUST be kept open.
NOTES