User's Manual

FC20-N Series Hardware Design
FC20-N_Series_Hardware_Design Confidential / Released 41 /
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6.2. Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted
properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering
quality, the thickness of stencil for the module is recommended to be 0.18mm. For more details,
please refer to document [5].
It is suggested that the peak reflow temperature is from 235ºC to 245ºC (for SnAg3.0Cu0.5 alloy). The
absolute maximum reflow temperature is 260ºC. To avoid damage to the module caused by repeated
heating, it is suggested that the module should be mounted after reflow soldering for the other side of
PCB has been completed. Recommended reflow soldering thermal profile is shown below:
Time (s)
50
100
150 200 250 300
50
100
150
200
250
160℃
200℃
217
0
70s~120s
40s~60s
Between 1~3℃/S
Preheat Heating Cooling
℃
s
Liquids
Temperature
Figure 18: Reflow Soldering Thermal Profile