User's Manual
GSM/GPRS/GNSS Module Series
MC20 Hardware Design
MC20_Hardware_Design Confidential / Released 86 / 95
thickness of stencil at the hole of the module pads should be 0.2 mm for MC20. For more details, please
refer to document [12]
It is suggested that the peak reflow temperature is from 235ºC to 245ºC (for SnAg3.0Cu0.5 alloy). The
absolute maximum reflow temperature is 260ºC. To avoid damage to the module caused by repeated
heating, it is suggested that the module should be mounted after reflow soldering for the other side of
PCB has been completed. Recommended reflow soldering thermal profile is shown below:
Time(s)
50
100
150 200 250 300
50
100
150
200
250
160℃
200℃
217
0
70s~120s
40s~60s
Between 1~3℃/S
Preheat Heating Cooling
℃
s
Liquids
Temperature
Figure 47: Reflow Soldering Thermal Profile
7.3. Packaging
The modules are stored in a vacuum-sealed bag which is ESD protected. It should not be opened until the
devices are ready to be soldered onto the application.