User's Manual

LTE Module
EC20 Hardware Design
EC20_Hardware_Design Confidential / Released 63 / 83
Figure 36: Recommended Stencil
1. The thickness of stencil for the pads at the bottom of module is recommended as 0.18mm, and the
thickness of LCC pins is recommended as 0.2mm.
2. For better SMT solder, the GND pad at the bottom of the module is divided into four small pads.
3. The red areas are recommended footprint shown in Figure 35.
NOTES