User's Manual

UMTS/HSDPA Module Series
UC15 Hardware Design
UC15_Hardware_Design Confidential / Released 73 / 78
It is suggested that peak reflow temperature is 235~245ºC (for SnAg3.0Cu0.5 alloy). Absolute max reflow
temperature is 260ºC. To avoid damage to the module when it was repeatedly heated, it is suggested that
the module should be mounted after the first panel has been reflowed. The following picture is the actual
diagram which we have operated.
Figure 48: Reflow Soldering Profile
7.3. Packaging
UC15 is packaged in the tap and reel carriers. One reel is 12.4m length and contains 250pcs modules.
The following figure shows the package details.