User Manual

GSM/GPRS Module Series
GC10 Hardware Design
GC10_Hardware_Design Confidential / Released 68 / 76
It is suggested that peak reflow temperature is from 235 ºC to 245ºC (for SnAg3.0Cu0.5 alloy). Absolute
max reflow temperature is 260ºC. To avoid damaging the module when it was repeatedly heated, it is
suggested that the module should be mounted after the first panel has been reflowed. The following
picture is the actual diagram which we have operated.
Figure 46: Ramp-Soak-Spike Reflow Profile
7.3. Packaging
The modules are stored inside a vacuum-sealed bag which is ESD-protected. It should not be opened
until the devices are ready to be soldered onto the application.
7.3.1. Tape and Reel Packaging
The reel is 330mm in diameter and each reel contains 250 modules.