User Manual

GSM/GPRS Module Series
GC10 Hardware Design
GC10_Hardware_Design Confidential / Released 67 / 76
7.2. Soldering
The squeegee should push the paste on the surface of the stencil that makes the paste fill the stencil
openings and penetrate to the PCB. The force on the squeegee should be adjusted so as to produce a
clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil at
the hole of the module pads should be 0.2 mm for GC10.
Figure 45: The Picture of Printing Paste