User's Manual
Table Of Contents
- Contents
- Table Index
- Figure Index
- 0. Revision history
- 1. Introduction
- 2. Product concept
- 3. Application interface
- 3.1. Pin
- 3.2. Operating modes
- 3.3. Power supply
- 3.4. Power on and down scenarios
- 3.5. Power saving
- 3.6. Summary of state transitions
- 3.7. RTC backup
- 3.8. Serial interfaces
- 3.9. Audio interfaces
- 3.10. SIM card interface
- 3.12. Behaviors of the RI
- 3.13. Network status indication
- 3.14. Operating status indication
- 4. Antenna interface
- 5. Electrical, reliability and radio characteristics
- 6. Mechanical dimensions
- 7. Storage and Manufacturing
- Appendix A: GPRS coding schemes
- Appendix B: GPRS multi-slot classes
M95 Hardware Design
M95_HD_V1.0 - 70 -
7. Storage and Manufacturing
7.1. Storage
M95 is distributed in vacuum-sealed bag. The restriction of storage condition is shown as below.
Shelf life in sealed bag: 12 months at <40 ºC / 90%RH
After this bag is opened, devices that will be subjected to reflow solder or other high temperature
process must be:
Mounted within 72 hours at factory conditions of ≤30 ºC /60% RH
Stored at <10% RH
Devices require bake, before mounting, if:
Humidity indicator card is >10% when read 23 ºC ±5 ºC
Mounted for more than 72 hours at factory conditions of ≤30 ºC /60% RH
If baking is required, devices may be baked for 48 hours at 125 ºC ±5 ºC
Note: As plastic container cannot be subjected to high temperature, devices must be removed
prior to high temperature (125 ºC ) bake. If shorter bake times are desired, please refer to
IPC/JEDECJ-STD-033 for bake procedure.