Specifications
NSTS 21000-IDD-760XD
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4.0 MECHANICAL
4.1 PHYSICAL OUTLINE
The PGSC Flight Laptop has almost the same footprints as the commercial IBM ThinkPad
760XD. Its dimensions are 2.0 inches high, 11.7 inches wide, and 8.3 inches in depth with
display folded down in the stowed position. For the PGSC with expansion assembly the
dimensions are 3.5 inches high, 15.5 inches wide, and 16.5 inches in depth.
4.2 THERMAL
One fan is located in the rear of the Expansion Unit Assembly for cooling. There is also a fan
mounted internally on the Video card within the IBM ThinkPad 760XD computer with a small
outlet vent on the rear of the computer. The fan within the computer is not visible or
accessible to the user. The fans in the expansion chassis and computer allow for cooler
operation in the microgravity environment. However, testing performed on the computer
indicated a 7 degree Fahrenheit exceedance of the 113-degree F allowable touch temperature
limit. A waiver for this requirement was applied for and granted (ref. G05149). Do not block
the vent or fan during operation of the units.
4.3 Velcro LOCATIONS AND OUTSIDE DIMENSIONS
The structural interface with habitable modules (Space Shuttle Orbiter, SpaceHab, etc.) is with
Velcro. Refer to drawing SDZ39129262, Computer Assembly, Payload and General Support
Computer (PGSC) and SEZ39131224, Expansion Unit Assembly, for details of Velcro
placement, connectors, and markings. See Figure 4-1 and Figure 4-2 for illustration of
Velcro placement.