User's Manual

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E1P7 October 2008
Windows is a registered trademark of Microsoft Corporation in the United States and other countries.
The information presented is subject to change without notice.
Conformance statements
Industry Canada Notice:
This device complies with RSS-210 of the Industry Canada Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation.
IMPORTANT NOTE:
Radiation Exposure Statement:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating
instructions for satisfying RF exposure compliance. To maintain compliance with IC RF exposure compliance requirements, please follow operation
instruction as documented in this manual.
EU Compliance
This product has been tested in accordance to, and complies with the European Low Voltage Directive (73/23/EEC) and European EMC
Directive (89/336/EEC). Copies of the Declaration of Compliance and installation information in accordance with the requirements in accordance with EU
directives can be obtained from the local Alcatel-Lucent representative or by contacting the Local Alcatel-Lucent Office.
Declaration of RoHS Compliance
This product has been designed and manufactured in compliance with Directive 2002/95/EC of the European Parliament and the Council on restriction of the
use of certain hazardous substances in electrical and electronic equipment (RoHS Directive) and is deemed to comply with the maximum concentration
values issued by the European Technical Adaptation Committee (TAC) as shown below:
Certain components of products as stated above are exempted under the Annex of the RoHS Directives as noted below:
Examples of exempted components are:
(1) Mercury in compact fluorescent lamps not exceeding 5 mg per lamp and in other lamps not specifically mentioned in the Annex of RoHS
Directive.
(2) Lead in glass of cathode ray tubes, electronic components, fluorescent tubes, and electronic ceramic parts (e.g. piezoelectronic devices).
(3) Lead in high temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).
(4) Lead as an allotting element in steel containing up to 0.35% lead by weight, aluminium containing up to 0.4% lead by weight and as a cooper
alloy containing up to 4% lead by weight.