Product specifications

GSP-1620 Modem Product Specification
80-99240-1 Rev. D 5-15
OEM Installation of the GSP-1620 Modem
QUALCOMM offers the GSP-1620 modem without a
mechanical enclosure, anticipating that OEMs will integrate
and package the modem into an enclosure or cabinet
appropriate to the end-user’s application. The enclosure must
shield the GSP-1620 modem from direct impacts,
precipitation, vibration, acoustic noise, and particulates.
The GSP-1620 modem has six mounting holes sized for M3
screws. All six mounting locations of the modem must be
fastened to a rigid structure to meet the vibration and shock
requirements specified in Chapter 6, Environmental
Specifications.
For hole size and locations, connector locations, and overall
envelope dimensions, see Figure 5-1 on page 5-2 and Figure
5-2 on page 5-3.
Caution
When mounting the GSP-1620 modem into an enclosure or onto a
surface, OEMs must exercise care during the process. Adhere to
the following recommendations:
• Observe handling precautions necessary to avoid damage
by ESD.
• Fasten the modem to a planar surface of sufficient
flatness and rigidity to prevent flexing of the modem.
• Use shock mounts when the environment includes
vibration in excess of that shown in Figure 6-2 on page
6-4.
• Use acoustic dampening material when the environment
includes acoustic noise in excess of 110 dB OSPL (Overall
Sound Pressure Level).
• Do not use fasteners that will damage the grounding
areas around the through holes.
• Do not fasten the modem using tools with speed and/or
torque that will cause damage to the printed circuit
board.