Product Specs

Packet Modem Spec Rev6.doc 43 06/09/00
9. Module Testing and Integration
This chapter outlines the testing performed at Qualcomm and the suggested
testing by the OEM Customer. This test flow will be part of the warranty /
product support plan that Qualcomm will use for module returns.
9.1 Qualcomm Module Production Testing
The module is assembled by using standard Surface Mount Technology
(SMT) and fully tested to verify functional performance of the module before
it leaves the factory.
The module will be packaged separately from the antenna, and will not be supplied with
an antenna cable. The second paragraph to this section needs to be changed
The module is then static wrapped, and packaged in groups of 50 to a box. 50
antennas will be packaged separately and will ship as “one” kit when ordered
by the OEM Customer.
It is anticipated that once the module has received at the OEM Customer
location an incoming QA test at the OEM plant will be able to determine that
the module is functional.
9.2 OEM VAR Module Testing