Specifications

System Chassis and Sub-Assemblies QSSC-S4R Technical Product Specification
96
x CPU heat-sink dividers isolate the flow channels through each CPU and eliminate the need for CPU dummies
x Provided air deflectors for IOH and VR cooling
CPU heat-sinks are board mounted, as shown in the figure below.
Figure 43. Strengthened CPU installation on Main Board
10.4 Peripheral Bay Subsystem
The following peripheral devices are supported:
x Hard Disk Drives
x Slim-line SATA DVD-RW drive
x One 5.25” device bay
A hot swap backplane (HSBP) provides power and I/O for the hard disk drives and slimline optical drive. See “Hot
Swap Backplane (HSBP)” on page 68 for more information on the HSBP. A separate 4-pin 12V molex power connector
is provided for powering the 5.25” device. I/O for the 5.25” device can be accomplished via one of the SATA
connectors on the mainboard.
Figure 44. Peripheral Area
10.4.1 Hard Drive Carrier
The server supports eight hot swap drive carriers for the Enterprise SKU and six carriers for the Value SKU. Each
carrier holds a standard 2.5-inch SATA or SAS hard drive.