Specifications

Hot Swap Backplane (HSBP) QSSC-S4R Technical Product Specification
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8.2.8 SAS Enclosure Management
SAS enclosure management allows the Hot-swap Backplane to report SAS drive status and backplane temperature
readings. A SAS RAID controller will interface with the enclosure management. The SAS enclosure management
subsystem consists of one VSC storage management controller, and the associated serial peripheral interface (SPI)
Flash and electrically erasable programmable read-only memory (EEPROM) memory devices.
8.2.9 Server Management Interface
The Hot-swap Backplane supports the following server management features:
x Two SGPIO Interfaces
x Hot-swap controller (HSC) Secure Digital Input/Output (SDIO) Interface
x UART Serial Interface
x Local I
2C* Interface
x System I
2C* Interface
x Local I
2C* Bus
x Isolated Global I
2C* Bus IPMB
8.2.9.1 Two SGPIO Interfaces
There are two SGPIO interfaces for cable A (drives 0-3) and cable B (drives 4-7). The interfaces communicate the fault
LED and present information.
8.2.9.2 HSC SDIO Interface
This interface communicates with the M25P80 flash module to access the board firmware.
8.2.9.3 UART Serial Interface
There is one serial port interface.
8.2.9.4 Local I
2
C* Interface
The local I
2
C* interface is as follows:
x Hot-swap backplane FRU
x Hot-swap backplane temperature sensor
x One temperature sensor is attached to the local I
2C* bus of each of the two expanders.
x Micro-controller interface
8.2.9.5 Local I
2
C* Bus
The bus A local I
2
C* bus connects the TMP75 thermal sensor and Atmel* AT24C64N (or equivalent) serial EEPROM
(with FRU data) to the Vitesse* VSC410
8.2.9.6 I
2
C* I/O Bus
The bus connects the system server management controller to the PCA9554* device used for fan sensing and LED
control.
8.2.9.7 I2C* Addresses
Two I²C* devices and their addresses and one global I²C device are listed in
Table 22. I
2
C* Addresses
Device Address Bus Description