GaN performance interdependent on package
APEC 2015 Seminar S17
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Two key factors for minimizing losses:
– Minimize GaN – Si interconnect inductance
– Eliminate common-source inductance with Kelvin connection
REF: Z. Liu, X. Huang, FC Lee, Q. Li, “Investigation of Package Influence on High Voltage Cascode GaN HEMT with
Simulation Model,” CPES review 2-13-2013, Milpitas, CA