Datasheet

D
4/03
TNY253/254/255
16
PI-2077-041003
1
A
J1
4
L
85
C
G08A
SMD-8
D S .004 (.10)
J2
E S .010 (.25)
-E-
-D-
B
-F-
M
J3
DIM
A
B
C
G
H
J1
J2
J3
J4
K
L
M
P
α
inches
0.367-0.387
0.240-0.260
0.125-0.145
0.004-0.012
0.036-0.044
0.057-0.068
0.048-0.053
0.032-0.037
0.007-0.011
0.010-0.012
0.100 BSC
0.030 (MIN)
0.372-0.388
0-8°
mm
9.32-9.83
6.10-6.60
3.18-3.68
0.10-0.30
0.91-1.12
1.45-1.73
1.22-1.35
0.81-0.94
0.18-0.28
0.25-0.30
2.54 BSC
0.76 (MIN)
9.45-9.86
0-8°
Notes:
1. Package dimensions conform to JEDEC
specification MS-001-AB (issue B, 7/85)
except for lead shape and size.
2. Controlling dimensions are inches.
3. Dimensions shown do not include mold
flash or other protrusions. Mold flash or
protrusions shall not exceed .006 (.15) on
any side.
4. D, E and F are reference datums on the
molded body.
K
G
α
H
.004 (.10)
J4
P
.010 (.25) M A S
.420
.046
.060
.060
.046
.080
Pin 1
.086
.186
.286
Solder Pad Dimensions