Datasheet

Rev. J 06/13
16
LNK302/304-306
www.powerint.com
PI-4526-040110
D07C
3.90 (0.154) BSC
Notes:
1. JEDEC reference: MS-012.
2. Package outline exclusive of mold flash and metal burr.
3. Package outline inclusive of plating thickness.
4. Datums A and B to be determined at datum plane H.
5. Controlling dimensions are in millimeters. Inch dimensions
are shown in parenthesis. Angles in degrees.
0.20 (0.008)
C
2X
1
4
5
8
2
6.00 (0.236) BSC
D
4
A
4.90 (0.193) BSC
2
0.10 (0.004)
C
2X
D
0.10 (0.004)
C
2X
A-B
1.27 (0.050) BSC
7X 0.31 - 0.51 (0.012 - 0.020)
0.25 (0.010)
M
C A-B D
0.25 (0.010)
0.10 (0.004)
(0.049 - 0.065)
1.25 - 1.65
1.75 (0.069)
1.35 (0.053)
0.10 (0.004)
C
7X
C
H
o
1.27 (0.050)
0.40 (0.016)
GAUGE
PLANE
0 - 8
1.04 (0.041) REF
0.25 (0.010)
BSC
SEATING
PLANE
0.25 (0.010)
0.17 (0.007)
DETAIL A
DETAIL A
C
SEATING PLANE
Pin 1 ID
B
4
+
+
+
4.90 (0.193)
1.27 (0.050)
0.60 (0.024)
2.00 (0.079)
Reference
Solder Pad
Dimensions
+
SO-8C (D Package)