User Manual

PRODUCT SPECIFICATION
POLYCOM
ED
2.0
DATE
29-06-2011
SIGN
HBR
Page 10 of 12
Model no.: KT4586
141993XX-DS
Recommended re-flow profile
t1: Max. Change in temperature
3°C/sec.
t2: Time in preheat (150°C < temp. < 190°C)
60 - 120 sec.
t3: Time in reflow zone (temp. > 220°C)
30 - 60 sec.
t4: Peak temperature
237°C±5°C
T1 Preheat zone bottom
150°C
T2 Preheat zone top
190°C
T3 Reflow zone
220°C
0°
T1 150°C
T2 190°C
T3 220°C
50°
t1
t2
Meltingpoint 217°C
150°
100°
250°
200°
Reflow profile – leadfree
Sn96.5-Ag3.0-Cu0.5
t3
t4
Temp. C°
Time
We recommend to fabricate PCB in accordance with IPC-A-600G, IPC-6012B, IPC-
6016/A and IPC-6018A, Class 2; per IPC-6011 using customer supplied data files.