Data Sheet

DocID031281 Rev 2 31/35
VL53L1X Packaging and labeling
35
8.5 Pb-free solder reflow process
Table 18 and Figure 24 show the recommended and maximum values for the solder profile.
Customers have to tune the reflow profile depending on the PCB, solder paste, and material
used. We expect customers to follow the recommended reflow profile, which is specifically
tuned for VL53L1X package.
For any reason, if a customer must perform a reflow profile which is different from the
recommended one (especially peak >240 °C), this new profile must be qualified by the
customer at their own risk. In any case, the profile has to be within the “maximum” profile
limit described in
Table 18.
Figure 24. Solder profile
Note: Temperature mentioned in Table 18 is measured at the top of the VL53L1X package.
Note: The component should be limited to a maximum of three passes through this solder profile.
Table 18. Recommended solder profile
Parameters Recommended Maximum Units
Minimum temperature (T
S
min)
Maximum temperature (T
S
max)
Time t
s
(T
S
min to T
S
max)
130
200
90-110
150
200
60 - 120
°C
°C
s
Temperature (T
L
)
Time (t
L
)
Ramp up
217
55-65
2
217
55 - 65
3
°C
s
°C/s
Temperature (T
p-10
)
Time (t
p-10
)
Ramp up
-
-
-
235
10
3
°C
s
°C/s
Peak temperature (Tp) 240 245 °C
Time to peak 300 300 s
Ramp down (peak to T
L
)-4-6°C/s