Data Sheet

DRV8834
SLVSB19D –FEBRUARY 2012–REVISED MARCH 2015 www.ti.com
7.4 Thermal Information
DRV8834
THERMAL METRIC
(1)
PWP [HTSSOP] RGE [VQFN] UNIT
24 PINS 24 PINS
R
θJA
Junction-to-ambient thermal resistance 40.2 35.1
R
θJC(top)
Junction-to-case (top) thermal resistance 23.7 36.6
R
θJB
Junction-to-board thermal resistance 21.9 12.2
°C/W
ψ
JT
Junction-to-top characterization parameter 0.7 0.6
ψ
JB
Junction-to-board characterization parameter 21.7 12.2
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 3.9 4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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