Data Sheet

ManualsBrandsPololu ManualsStepper Motor ControllersPololu Tic T500 USB Multi-Interface Stepper Motor Controller

ADECAY

AOUT1

AISEN

AOUT2

BOUT2

BISEN

BOUT1

nENBL / AENBL

STEP / BENBL

DIR / BPHASE

AISEN

BISEN

BDECAY

nSLEEP

AVREF

GND

VINT

nFAULT

CONFIG

M0 / APHASE

BVREF

VREFO

0.01 µF

2.2 µF

0.01 µF

VCP

Logic high

voltage

10 µF

DRV8834

SLVSB19D –FEBRUARY 2012–REVISED MARCH 2015

www.ti.com

11 Layout

11.1 Layout Guidelines

The VM pin should be bypassed to GND using low-ESR ceramic bypass capacitors with a recommended value

of 0.01-μF rated for VM. This capacitor should be placed as close to the VM pin as possible with a thick trace or

ground plane connection to the device GND pin. The VM pin must be bypassed to ground using an appropriate

bulk capacitor. This component may be an electrolytic and should be located close to the DRV8834. A low-ESR

ceramic capacitor must be placed in between the VM and VCP pins. TI recommends a value of 0.01- μF rated

for 16 V. Place this component as close to the pins as possible.

Bypass VINT to ground with a 2.2-μF ceramic capacitor rated 6.3 V. Place this bypass capacitor as close to the

pin as possible.

11.2 Layout Example

Figure 24. Recommended Layout

11.3 Thermal Considerations

11.3.1 Maximum Output Current

In actual operation, the maximum output current achievable with a motor driver is a function of die temperature.

This in turn is greatly affected by ambient temperature and PCB design. Basically, the maximum motor current

will be the amount of current that results in a power dissipation level that, along with the thermal resistance of the

package and PCB, keeps the die at a low enough temperature to stay out of thermal shutdown.

The thermal data given in the data sheet can be used as a guide to calculate the approximate maximum power

dissipation that can be expected to be possible without entering thermal shutdown for several different PCB

constructions. However, for accurate data, the actual PCB design must be analyzed via measurement or thermal

simulation.

Product Folder Links: DRV8834