Data Sheet

DocID027112 Rev 4 23/50
LPS25HB Application hints
50
5.1 Soldering information
The HLGA package is compliant with the ECOPACK
®
standard and it is qualified for
soldering heat resistance according to JEDEC J-STD-020.
The HLGA package is compliant with the ECOPACK
®
, RoHS and "Green" standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave "Pin 1 Indicator" unconnected during soldering.
Please refer the technical note TN1198, “Surface mount guidelines for MEMS sensors in
HLGA packages” available on www.st.com for any additional information
Land pattern and soldering recommendations are available at www.st.com/mems.