Data Sheet

4
DRV8835
SLVSB18G –MARCH 2012 –REVISED MAY 2016 www.ti.com
Product Folder Links: DRV8835
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) Power dissipation and thermal limits must be observed.
6 Specifications
6.1 Absolute Maximum Ratings
See
(1)(2)
MIN MAX UNIT
Power supply voltage, VM –0.3 12 V
Power supply voltage, VCC –0.3 7 V
Digital input pin voltage –0.5 VCC + 0.5 V
Peak motor drive output current Internally limited A
Continuous motor drive output current per H-bridge
(3)
–1.5 1.5 A
T
J
Operating junction temperature –40 150 °C
T
stg
Storage temperature –60 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±1500
(1) Power dissipation and thermal limits must be observed.
6.3 Recommended Operating Conditions
T
A
= 25°C (unless otherwise noted)
MIN NOM MAX UNIT
V
CC
Device power supply voltage 2 7 V
V
M
Motor power supply voltage 0 11 V
V
IN
Logic level input voltage 0 V
CC
V
I
OUT
H-bridge output current
(1)
0 1.5 A
ƒ
PWM
Externally applied PWM frequency 0 250 kHz
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC
(1)
DRV8835
UNITDSS (WSON)
12 PINS
R
θJA
Junction-to-ambient thermal resistance 50.4 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 58 °C/W
R
θJB
Junction-to-board thermal resistance 19.9 °C/W
ψ
JT
Junction-to-top characterization parameter 0.9 °C/W
ψ
JB
Junction-to-board characterization parameter 20 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 6.9 °C/W