Datasheet

Electrical data STSPIN820
6/29 DocID031065 Rev 2
2 Electrical data
2.1 Absolute maximum ratings
2.2 Recommended operating conditions
2.3 Thermal data
Table 1. Absolute maximum ratings
Symbol Parameter Test condition Value Unit
V
S
Supply voltage - -0.3 to 48 V
V
IN
Logic input voltage - -0.3 to 5.5 V
V
OUT,diff
Differential voltage between VS, OUTx1, OUTx2 and SENSEx pins - up to 48 V
V
SENSE
Sense pins voltage - -2 to 2 V
V
REF
Reference voltage input - -0.3 to 2 V
I
OUT,RMS
Continuous power stage output current (each full-bridge) - 1.5 A
rms
T
j
Junction temperature - -40 to 150 °C
T
STG
Storage temperature - -55 to 150 °C
Table 2. Recommended operating conditions
Symbol Parameter Min. Typ. Max. Unit
V
S
Supply voltage 7 - 45 V
V
IN
Logic input voltage - - 5 V
V
SENSE
Sense pins voltage -1 - +1 V
V
REF
Reference voltage input 0.1 - 1 V
Table 3. Thermal data
Symbol Parameter Conditions Value Unit
R
thJA
Junction to ambient thermal resistance Natural convection, according to JESD51-2A
(1)
36.5 °C/W
R
thJCtop
Junction to case thermal resistance
(top side)
Cold plate on top package, according to
JESD51-12
(1)
27.6 °C/W
R
thJCbot
Junction to case thermal resistance
(bottom side)
Cold plate on exposed pad, according to
JESD51-12
(1)
5.9 °C/W
R
thJB
Junction to board thermal resistance according to JESD51-8
(1)
13.6 °C/W

JT
Junction to top characterization According to JESD51-2A
(1)
1°C/W

JB
Junction to board characterization According to JESD51-2A
(1)
13.7 °C/W
1. Simulated on a 76.2 x 114.3 x 1.6 mm, with vias underneath the component, the 2s2p board as per the standard JEDEC
(JESD51-7) in natural convection.