Datasheet
Table Of Contents
- 1 Block diagram
- 2 Electrical data
- 3 Electrical characteristics
- 4 Pin connection
- 5 Functional description
- 5.1 Power supply and standby
- 5.2 Microstepping sequencer
- Table 7. Step mode selection through MODEx inputs
- Figure 4. MODEx, STCK and DIR timing diagram
- Table 8. Target reference and current direction according to sequencer value (full-step mode)
- Table 9. Target reference and current direction according to sequencer value (not full-step mode)
- Table 10. Example
- 5.3 PWM current control
- 5.4 Overcurrent and short-circuit protections
- 5.5 Thermal shutdown
- 5.6 ESD protection strategy
- 6 Typical applications
- 7 Layout recommendations
- 8 Package information
- 9 Ordering information
- 10 Revision history
List of figures STSPIN820
4/29 DocID031065 Rev 2
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 3. UVLO protection management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 4. MODEx, STCK and DIR timing diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 5. PWM current control sequence in mixed decay (DECAY = '0') . . . . . . . . . . . . . . . . . . . . . 17
Figure 6. OFF time regulation circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 7. OFF time vs R
OFF
value . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 8. Overcurrent and short-circuit protections management . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 9. Disable time versus R
EN
and C
EN
values (V
DD
= 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 10. Overcurrent threshold versus temperature normalized at 25 °C . . . . . . . . . . . . . . . . . . . . 21
Figure 11. Thermal shutdown management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 12. ESD protection strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 13. Typical application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 14. PCB layout example (top layer) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 15. TFQFPN 4 x 4 x 1.05- 24L package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 16. TFQFPN 4 x 4 x 1.05 - 24L suggested footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27