MC33926 Datasheet
Table Of Contents
- 5.0 A Throttle Control H-Bridge
- Figure 1. 33926 Simplified Application Diagram
- Internal Block Diagram
- Pin Connections
- Electrical Characteristics
- Table 2. Maximum Ratings
- Table 3. Static Electrical Characteristics
- Table 4. Dynamic Electrical Characteristics
- Figure 4. Output Delay Time
- Figure 5. Disable Delay Time
- Figure 6. Output Switching Time
- Figure 7. Current Limit Blanking Time and Constant-OFF Time
- Figure 8. Short-circuit Detection Turn-OFF Time tFAULT
- Figure 9. Output Current Limiting Foldback Region
- Functional Description
- Functional Internal Block Description
- Functional Device operation
- Typical applications
- Packaging
- Additional Documentation
- Table 6. Thermal Performance Comparison
- Figure 15. Surface Mount for Power PQFN with Exposed Pads
- Figure 16. Thermal Test Board
- Table 7. Thermal Resistance Performance
- Figure 17. Device on Thermal Test Board RqJA
- Figure 18. Transient Thermal Resistance RqJA, 1.0 W Step response, Device on Thermal Test Board Area A = 600 (mm2)
- Revision History
Analog Integrated Circuit Device Data
Freescale Semiconductor 9
33926
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics
Characteristics noted under conditions 8.0 V ≤ V
PWR
≤ 28 V, - 40°C ≤ T
A
≤ 125°C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at T
A
= 25°C under nominal conditions unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
TIMING CHARACTERISTICS
PWM Frequency
(21)
f
PWM
– – 20 kHz
Maximum Switching Frequency During Current Limit Regulation
(22)
f
MAX
– – 20 kHz
Output ON Delay
(23)
V
PWR
= 14 V
t
D
ON
– – 18
μs
Output OFF Delay
(23)
V
PWR
= 14 V
t
D
OFF
– – 12
μs
I
LIM
Output Constant-OFF Time
(24)
t
A
15 20.5 32
μs
I
LIM
Blanking Time
(25)
t
B
12 16.5 27
μs
Disable Delay Time
(26)
t
DDISABLE
– – 8.0 μs
Output Rise and Fall Time
(27)
SLEW = SLOW
SLEW = FAST
t
F
, t
R
1.5
0.2
3.0
–
6.0
1.45
μs
Short-circuit / Over-temperature Turn-OFF (Latch-OFF) Time
(28)
(29)
t
FAULT
– – 8.0 μs
Power-ON Delay Time
(29)
t
POD
– 1.0 5.0 ms
Output MOSFET Body Diode Reverse Recovery Time
(29)
t
R R
75 100 150
ns
Charge Pump Operating Frequency
(29)
f
CP
– 7.0 – MHz
Notes
21. The maximum PWM frequency is obtained when the device is set to Fast Slew Rate via the SLEW pin. PWM-ing when SLEW is set to
SLOW should be limited to frequencies <
11 kHz in order to allow the internal high side driver circuitry time to fully enhance the high side
MOSFETs.
22. The internal current limit circuitry produces a constant-OFF-time Pulse Width Modulation of the output current. The output load’s
inductance, capacitance, and resistance characteristics affect the total switching period (OFF-time + ON-time), and thus the PWM
frequency during current limit.
23. Output Delay is the time duration from 1.5 V on the IN1 or IN2 input signal to the 20% or 80% point (dependent on the transition direction)
of the OUT1 or OUT2 signal. If the output is transitioning HIGH-to-LOW, the delay is from 1.5
V on the input signal to the 80% point of
the output response signal. If the output is transitioning LOW-to-HIGH, the delay is from 1.5
V on the input signal to the 20% point of the
output response signal. See
Figure 4, page 10.
24. The time during which the internal constant-OFF time PWM current regulation circuit has tri-stated the output bridge.
25. The time during which the current regulation threshold is ignored so that the short-circuit detection threshold comparators may have time
to act.
26. Disable Delay Time measurement is defined in Figure 5, page 10.
27. Rise Time is from the 10% to the 90% level and Fall Time is from the 90% to the 10% level of the output signal with V
PWR
= 14 V,
R
LOAD
= 3.0 ohm. See Figure 6, page 10.
28. Load currents ramping up to the current regulation threshold become limited at the I
LIM
value (see Figure 7). The short-circuit currents
possess a di/dt that ramps up to the I
SCH
or I
SCL
threshold during the I
LIM
blanking time, registering as a short-circuit event detection and
causing the shutdown circuitry to force the output into an immediate tri-state latch-OFF (see
Figure 8). Operation in Current Limit mode
may cause junction temperatures to rise. Junction temperatures above ~160°C will cause the output current limit threshold to “fold back”,
or decrease, until ~175
°C is reached, after which the T
LIM
thermal latch-OFF will occur. Permissible operation within this fold back region
is limited to non-repetitive transient events of duration not to exceed 30 seconds (see
Figure 9).
29. Parameter is guaranteed by design.










