MC33926 Datasheet
Table Of Contents
- 5.0 A Throttle Control H-Bridge
- Figure 1. 33926 Simplified Application Diagram
- Internal Block Diagram
- Pin Connections
- Electrical Characteristics
- Table 2. Maximum Ratings
- Table 3. Static Electrical Characteristics
- Table 4. Dynamic Electrical Characteristics
- Figure 4. Output Delay Time
- Figure 5. Disable Delay Time
- Figure 6. Output Switching Time
- Figure 7. Current Limit Blanking Time and Constant-OFF Time
- Figure 8. Short-circuit Detection Turn-OFF Time tFAULT
- Figure 9. Output Current Limiting Foldback Region
- Functional Description
- Functional Internal Block Description
- Functional Device operation
- Typical applications
- Packaging
- Additional Documentation
- Table 6. Thermal Performance Comparison
- Figure 15. Surface Mount for Power PQFN with Exposed Pads
- Figure 16. Thermal Test Board
- Table 7. Thermal Resistance Performance
- Figure 17. Device on Thermal Test Board RqJA
- Figure 18. Transient Thermal Resistance RqJA, 1.0 W Step response, Device on Thermal Test Board Area A = 600 (mm2)
- Revision History
Analog Integrated Circuit Device Data
6 Freescale Semiconductor
33926
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Peak Package Reflow Temperature During Reflow
(7)
,
(8)
T
PPRT
250
°C
Approximate Junction-to-Case Thermal Resistance
(9)
R
θJC
< 1.0 °C/W
Notes
7. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C for Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
9. Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual R
θJB
(junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace thickness and area. Maximum current at maximum
die temperature represents ~16
W of conduction loss heating in the diagonal pair of output MOSFETs. Therefore, the R
θJA
must be
< 5.0°C/W for maximum current at 70°C ambient. Module thermal design must be planned accordingly.
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device. These parameters are not production tested.
Ratings Symbol Value Unit