MC33926 Datasheet
Table Of Contents
- 5.0 A Throttle Control H-Bridge
- Figure 1. 33926 Simplified Application Diagram
- Internal Block Diagram
- Pin Connections
- Electrical Characteristics
- Table 2. Maximum Ratings
- Table 3. Static Electrical Characteristics
- Table 4. Dynamic Electrical Characteristics
- Figure 4. Output Delay Time
- Figure 5. Disable Delay Time
- Figure 6. Output Switching Time
- Figure 7. Current Limit Blanking Time and Constant-OFF Time
- Figure 8. Short-circuit Detection Turn-OFF Time tFAULT
- Figure 9. Output Current Limiting Foldback Region
- Functional Description
- Functional Internal Block Description
- Functional Device operation
- Typical applications
- Packaging
- Additional Documentation
- Table 6. Thermal Performance Comparison
- Figure 15. Surface Mount for Power PQFN with Exposed Pads
- Figure 16. Thermal Test Board
- Table 7. Thermal Resistance Performance
- Figure 17. Device on Thermal Test Board RqJA
- Figure 18. Transient Thermal Resistance RqJA, 1.0 W Step response, Device on Thermal Test Board Area A = 600 (mm2)
- Revision History
Analog Integrated Circuit Device Data
Freescale Semiconductor 5
33926
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device. These parameters are not production tested.
Ratings Symbol Value Unit
ELECTRICAL RATINGS
Power Supply Voltage
Normal Operation (Steady-state)
Transient Over-voltage
(1)
V
PWR(SS)
V
PWR(t)
- 0.3 to 28
- 0.3 to 40
V
Logic Input Voltage
(2)
V
IN
- 0.3 to 7.0 V
SF Output
(3)
V
SF
- 0.3 to 7.0 V
Continuous Output Current
(4)
I
OUT(CONT)
5.0 A
ESD Voltage
(5)
Human Body Model
Machine Model
Charge Device Model
Corner Pins (1,9,17,25)
All Other Pins
V
ESD1
V
ESD2
± 2000
± 200
±750
±500
V
THERMAL RATINGS
Storage Temperature
T
STG
- 65 to 150 °C
Operating Temperature
(6)
Ambient
Junction
T
A
T
J
- 40 to 125
- 40 to 150
°C
Notes
1. Device will survive repetitive transient overvoltage conditions for durations not to exceed 500 ms @ duty cycle not to exceed 10%.
External protection is required to prevent device damage in case of a reverse battery condition.
2. Exceeding the maximum input voltage on IN1, IN2, EN, INV, SLEW, D1, or D2 may cause a malfunction or permanent damage to the
device.
3. Exceeding the pullup resistor voltage on the open drain SF pin may cause permanent damage to the device.
4. Continuous output current capability is dependent on sufficient package heatsinking to keep junction temperature ≤ 150°C.
5. ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500 Ω), ESD2 testing is performed in
accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0 Ω), and the Charge Device Model (CDM), Robotic (C
ZAP
= 4.0pF).
6. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking provided. Brief
non-repetitive excursions of junction temperature above 150
°C can be tolerated provided the duration does not exceed 30 seconds
maximum. (Non-repetitive events are defined as not occurring more than once in 24 hours.)