MC33926 Datasheet
Table Of Contents
- 5.0 A Throttle Control H-Bridge
- Figure 1. 33926 Simplified Application Diagram
- Internal Block Diagram
- Pin Connections
- Electrical Characteristics
- Table 2. Maximum Ratings
- Table 3. Static Electrical Characteristics
- Table 4. Dynamic Electrical Characteristics
- Figure 4. Output Delay Time
- Figure 5. Disable Delay Time
- Figure 6. Output Switching Time
- Figure 7. Current Limit Blanking Time and Constant-OFF Time
- Figure 8. Short-circuit Detection Turn-OFF Time tFAULT
- Figure 9. Output Current Limiting Foldback Region
- Functional Description
- Functional Internal Block Description
- Functional Device operation
- Typical applications
- Packaging
- Additional Documentation
- Table 6. Thermal Performance Comparison
- Figure 15. Surface Mount for Power PQFN with Exposed Pads
- Figure 16. Thermal Test Board
- Table 7. Thermal Resistance Performance
- Figure 17. Device on Thermal Test Board RqJA
- Figure 18. Transient Thermal Resistance RqJA, 1.0 W Step response, Device on Thermal Test Board Area A = 600 (mm2)
- Revision History
Analog Integrated Circuit Device Data
22 Freescale Semiconductor
33926
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Figure 16. Thermal Test Board
Device on Thermal Test Board Table 7. Thermal Resistance Performance
R
θ
JA
is the thermal resistance between die junction and
ambient air.
33926PNB Pin Connections
32-Pin PQFN
0.80 mm Pitch
8.0 mm x 8.0 mm Body
A
25
17
18
19
20
21
22
23
24
910111213141516
1
2
3
4
5
6
7
8
26272829303132
NC
NC
VPWR
NC
IN2
IN1
SLEW
OUT1
AGND
INV
FB
EN
OUT1
VPWR
VPWR
OUT2
OUT2
AGND
OUT1
D2
PGND
SF
D1
OUT2
OUT2
CCP
VPWR
PGND
PGND
PGND
PGND
PGND
OUT1
Material: Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline: 80 mm x 100 mm board area,
including edge connector for thermal
testing
Area A: Cu heat-spreading areas on board
surface
Ambient Conditions: Natural convection, still air
A [mm
2
] R
θ
JA
[°C/W]
0 81
300 49
600 40