Datasheet

www.sensirion.com Version 0.9 – August 2017 12/15
8.3 Package Outline
Figure 11 Package outlines drawing of the SGP30 with nominal values. Dimensions are given in
millimeters. The die pad shows a small recess in the bottom left part. * These dimensions are not
well defined and given as a reference only.
8.4 Landing Pattern
Figure 12 shows the PCB landing pattern. The landing pattern is understood to be the metal layer on the PCB, onto which the
DFN pads are soldered. The solder mask is understood to be the insulating layer on top of the PCB covering the copper
traces. It is recommended to design the solder mask as a Non-Solder Mask Defined (NSMD) type. For solder paste printing it
is recommended to use a laser-cut, stainless steel stencil with electro-polished trapezoidal walls and with 0.125 to 0.150 mm
stencil thickness. The length of the stencil apertures for the I/O pads should be the same as the PCB pads. However, the
position of the stencil apertures should have an offset of 0.1 mm away from the package center, as indicated in Figure 12. The
die pad aperture should cover 70 – 90 % of the die pad area, resulting in a size of about 1.05 mm x 1.5 mm.
For information on the soldering process and further recommendation on the assembly process please contact Sensirion.
Figure 12 Recommended landing pattern.
2.45
2.45
0.9
1.7
0.8
1.25
0.4
0.350.3x45
o
0.2*