Datasheet

www.sensirion.com Version 0.9 – August 2017 11/15

6.7 Communication Data Sequences

Figure 9 Communication sequence for starting a measurement and reading measurement results.

7 Quality

7.1 Environmental Stability

The qualification of the SGP30 will be performed based on the JEDEC JESD47 qualification test method.

7.2 Material Contents

The device is fully RoHS and WEEE compliant, e.g., free of Pb, Cd, and Hg.

8 Device Package

SGP30 sensors are provided in a DFN (dual flat no leads) package with an outline of 2.45 × 2.45 × 0.9 mm

and a terminal

pitch of 0.8 mm. The circular sensor opening of maximally 1.6 mm diameter is centered on the top side of the package. The

sensor chip is assembled on a Ni/Pd/Au plated copper lead frame. Sensor chip and lead frame are over-molded by a black,

epoxy-based mold compound. Please note that the side walls of the package are diced and therefore the lead frame sidewall

surfaces are not plated.

8.1 Moisture Sensitivity Level

The Moisture Sensitivity Level classification of the SGP30 is MSL1, according to IPC/JEDEC J-STD-020.

8.2 Traceability

All SGP30 sensors are laser marked for simple identification and traceability. The marking on the sensor consists of the

product name and a 4-digit, alphanumeric tracking code. This code is used by Sensirion for batch-level tracking throughout

production, calibration, and testing. Detailed tracking data can be provided upon justified request. The pin-1 location is

indicated by the keyhole pattern in the light-colored central area. See Figure 10 for illustration.

Figure 10 Laser marking on SGP30. The pin-1 location is indicated by the keyhole pattern in the

light-colored central area. The bottom line contains a 4-digit alphanumeric tracking code

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