Datasheet

PCM5100A , PCM5101A , PCM5102A
PCM5100A-Q1 , PCM5101A-Q1 , PCM5102A-Q1
SLAS859C –MAY 2012–REVISED MAY 2015 www.ti.com
8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
AVDD, CPVDD, DVDD –0.3 3.9
Supply voltage
LDO with DVDD at 1.8 V –0.3 2.25
DVDD at 1.8 V –0.3 2.25 V
Digital input voltage
DVDD at 3.3 V –0.3 3.9
Analog input voltage –0.3 3.9
Operating junction temperature range –40 130 °C
Storage temperature, T
stg
–65 150 °C
8.2 ESD Ratings
VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
(ESD)
Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-
±750
C101
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
MIN NOM MAX UNIT
VCOM mode 3 3.3 3.46
Referenced to
AVDD Analog power supply voltage range V
AGND
(1)
VREF mode 3.2 3.3 3.46
1.8 V DVDD 1.65 1.8 1.95
Referenced to
DVDD Digital power supply voltage range V
DGND
(1)
3.3 V DVDD 3.1 3.3 3.46
CPVDD Charge pump supply voltage range Referenced to CPGND
(1)
3.1 3.3 3.46 V
MCLK Master clock frequency 50 MHz
LOL, LOR Stereo line output load resistance 1 10 kΩ
C
LOUT
Digital output load capacitance 10 pF
T
J
Operating junction temperature range –40 130 °C
(1) All grounds on board are tied together; they must not differ in voltage by more than 0.2 V max, for any combination of ground signals.
8.4 Thermal Information
PW
THERMAL METRIC
(1)
UNIT
20 PINS
R
θJA
Junction-to-ambient thermal resistance 91.2
R
θJC(top)
Junction-to-case (top) thermal resistance 25.3
R
θJB
Junction-to-board thermal resistance 42
°C/W
ψ
JT
Junction-to-top characterization parameter 1
ψ
JB
Junction-to-board characterization parameter 41.5
R
θJC(bot)
Junction-to-case (bottom) thermal resistance —
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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